Tender Notice

Tender Detail

Fully automatic wafer slicing machine(3)

Tendering Authority
Tender Category
Other
Publish Date
28 Nov 2020
Deadline
11 Dec 2020
Country \ State
China
TenderNews Ref. No.
1392116201128-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.

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