Tender Notice

Tender Detail

Plasma etching machine for Ruijing high power semiconductor laser chip R & D and industrialization project(2)

Tendering Authority
Tender Category
Other
Publish Date
19 Sep 2020
Deadline
10 Oct 2020
Country \ State
China
TenderNews Ref. No.
2214516200919-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.

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