Tender Notice

Tender Detail

Harbin Institute of Technology 2.5D/3D Advanced Packaging Chip Design Software System Purchase Project

Tendering Authority
Tender Category
Other
Publish Date
03 Oct 2026
Deadline
23 Oct 2026
Country \ State
CHINA
TenderNews Ref. No.
3607916261003-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.

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