Tender Notice

Tender Detail

Back-end design, fabrication and packaging of IoT chip with special NV memories

Tendering Authority
Tender Category
Other
Publish Date
27 Jun 2020
Deadline
08 Jul 2020
Country \ State
Singapore
TenderNews Ref. No.
739817200627-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.

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